ST-Ericsson Reiterates Commitment to China
Demonstrates innovation at P&T/Wireless and Network Communications China 2009
At P&T/Wireless and Networks Communications China 2009, taking place in Beijing, September 16-20, ST-Ericsson and its Chinese subsidiary, T3G, emphasized commitment to continue their efforts of bringing innovative solutions to the Chinese market.
Samsung and ST-Ericsson partner to demonstrate the latest in mobile broadband in China
At the event, ST-Ericsson is supporting Samsung in the demonstration of a new TD-HSUPA device. The Samsung device is based on world’s first 65-nm TD-HSPA chipset from ST-Ericsson and on an industry-mature dual-mode solution, combining advanced TD-HSPA and EDGE. The chipset enables the consumer to enjoy uplink speeds of up to 2.2Mbps. Built on ST-Ericsson’s mobile platform, M6718, the device is being demonstrated at the Samsung booth (number W1000).
ST-Ericsson demonstrates latest in TD technology and multimedia
At its main demonstration area at the Crowne Plaza International Airport Hotel, ST-Ericsson is demonstrating the latest and the next generation in TD technology, including advanced LTE prototype devices and latest TD-HSPA/EDGE solutions.
Visitors can experience a range of integrated multimedia and the latest highly-integrated smartphone solutions. Enhanced experience in multimedia builds on industry leading features such as one-shot panorama capabilities, high-quality audio and adaptive backlight for video streaming with reduced power consumption.
ST-Ericsson and T3G feature on the exhibition
TD-SCDMA Industry Alliance’s (TDIA) pavilion in Hall E1 features ST-Ericsson’s subsidiary T3G, with its latest developments in TD, such as fast downloads of digital content and an advanced e-paper book reading experience. ST-Ericsson is also featured at the Ericsson stand, also in Hall E1.
Notes to editors
ST-Ericsson announced the industry’s first TD-HSPA modem chip samples in 65nm on September 14, 2009. Read more at: http://www.stericsson.com/press_releases/TD-HSPA_Modem-Chip_Samples.jsp
About ST-Ericsson
ST-Ericsson is a world leader in developing and delivering a complete portfolio of innovative mobile platforms and cutting-edge wireless semiconductor solutions across the broad spectrum of mobile technologies. The company is a leading supplier to the top handset manufacturers and ST-Ericsson’s products and technologies enable more than half of all phones in use today. The company generated pro-forma sales of about USD 3.6 billion in 2008. ST-Ericsson was established as a 50/50 joint venture by STMicroelectronics (NYSE:STM) and Ericsson (NASDAQ:ERIC) in February 2009, with headquarters in Geneva, Switzerland. More information about ST-Ericsson is available at www.stericsson.com.
About T3G
T3G, an ST-Ericsson company, is the leading chipset and solution supplier of TD-SCDMA terminal products. As a pioneer in TD-SCDMA chip R&D and technology leader in the wireless industry, T3G specializes in providing complete TD-SCDMA terminal system solutions to handset manufacturers and design houses. T3G’s core technology and solution offerings include handset chipset, software protocol, system reference design and customized technical support. For more information about T3G, its products, and services please visit www.t3gt.com.
FOR FURTHER INFORMATION, PLEASE CONTACT:
Media Relations (in English)
Phone: +41 22 930 2733
T3G (in Chinese)
Maggie Huo
Phone: +86 10 622 99 126
Email: yujia.huo@t3gt.com