ST-Ericsson Continues to Drive Innovation in TD Market
ST-Ericsson Delivers Industry's First TD-HSPA Modem Chip Samples in 65nm
ST-Ericsson, a world leader in wireless platforms and semiconductors, and its Chinese subsidiary T3G today announced the industry’s first TD-HSPA modem chip samples in 65nm. This new chip is smaller than existing products, making it easier to implement in mobile devices, and is also designed to reach significantly lower power consumption.
“By delivering a TD-HSPA solution in 65nm, we continue to push the boundaries of innovation in the Chinese mobile market,” said Johan Pross, responsible for ST-Ericsson China and CEO of T3G. “This advanced chip will enable our customers to develop a broad range of competitive mobile devices. Chinese consumers will enjoy higher mobile broadband connection speed while reaching power consumption levels comparable with WCDMA devices.”
This chip supports high speed broadband services on both downlink and uplink. It will enable speeds for downlink up to 2.8Mbps, and support uploading of content like photos, video and other files with speeds of up to 2.2Mbps, compared to today's 384Kbps. It fully complies with the 3GPP standard.
This chip is the industry’s first in TD-HSPA technology that makes use of the advanced 65nm manufacturing process and chip design. Besides bringing size and power consumption benefits this contributes to the affordability of final devices.
Commercial devices based on this chip will be available in the first half of 2010.
Notes to editors
This chip powers ST-Ericsson’s TD-HSPA platform, M6718.
About ST-Ericsson
ST-Ericsson is a world leader in developing and delivering a complete portfolio of innovative mobile platforms and cutting-edge wireless semiconductor solutions across the broad spectrum of mobile technologies. The company is a leading supplier to the top handset manufacturers and ST-Ericsson’s products and technologies enable more than half of all phones in use today. The company generated pro-forma sales of about USD 3.6 billion in 2008. ST-Ericsson was established as a 50/50 joint venture by STMicroelectronics (NYSE: STM) and Ericsson (NASDAQ: ERIC) in February 2009, with headquarters in Geneva, Switzerland. More information about ST-Ericsson is available at www.stericsson.com.
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