FD-SOI • Modem • mAR • Connectivity • Packaging • Power
ST-Ericsson’s multi-mode modem technology supports both LTE-TDD and LTE-FDD, in addition to TD-SCDMA and HSPA+/EDGE. This enable our customers to produce devices that will work across all the world’s leading mobile broadband technologies.
ST-Ericsson is a leading provider of connectivity solutions to the mobile market. We were one of the creators of Bluetooth and led the proliferation of FM and USB in mobile devices.
ST-Ericsson is a pioneer in packaging technologies, delivering highly integrated solutions that utilize die, package and PWB co-design for best-in-class performance, footprint and cost.
As a world leader in the development of wireless platforms and semiconductors, ST-Ericsson is right at the forefront of the drive to extend the battery lives of increasingly power-hungry mobile phones, tablets and other handheld devices.
FD-SOI is a technology that is available for design today and will allow existing designs in 28nm to benefit today already from significant improvements in performance and power. FD-SOI solves – with less process complexity – scaling, leakage and variability issues to further shrink CMOS technology beyond 28nm.
Augmented Reality uses the camera and the location to overlay digital data on the real world such as text, images, animations and links on the device display.